Hermetic packaging for PCB, protective and reliable package for electronics

American Fairfield Inc.

HERMETIC PACKAGING

  • Protection from external contaminants:
  • Extended lifespan:
  • Improved reliability:
  • High-performance requirements:
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Assembled LED digital display used our paste for LED application, silver sintering paste for high power LED

American Fairfield Inc

LED PACKAGING & LIGHTING

  • Adhesive
  • Paste
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electronic

American Fairfield Inc.

ELECTRONIC & ASSEMBLY

  • Solder paste application:
  • Component placement:
  • Reflow soldering:
  • Inspection:
  • Packing:
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chip

American Fairfield Inc.

SEMICONDUCTOR PACKAGING

  • Electrical connections:
  • Thermal management:
  • Protection from environmental factors:
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American Fairfield Inc

OPTICAL COMMUNICATION

  • Optical Modulator
  • Optical Fiber
  • Optical Adhesive
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INDUSTRIALl & ENGINEERING

  • Structural Adhesive
  • Brazing Solder
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AMERICAN FAIRFIELD INC.

MARKETS WE SERVE

SC

Consumer Electronics

  • Smartphones
  • Computers
  • Televisions
  • Audio equipment

Telecom & IT

  • Wireless telecommunication
  • Fiber-optic communication
  • Cloud computing
  • Internet of Things (IoT)

Industrial

  • Manufacturing
  • Energy
  • Construction
  • Transportation

Aerospace & Defense

  • Avionics
  • Electronic Warfare
  • Satellite Communications
  • Defense Electronics

Automative

  • Chip Packaging
  • Power Electronics Packaging
  • Sensor Packaging
  • Printed Circuit Board (PCB) Packaging

News & Blogs

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  • Revolutionizing Double-Sided PCB Assembly: AI T...

    Alisher Orazgaliyev

    Discover how AI Technology, Inc.'s innovative SAC-based Transient Liquid Phase Sintering (TLPS) solder paste is transforming double-sided PCB assembly by eliminating the need for SMT adhesives. This advancement enhances efficiency...

    Revolutionizing Double-Sided PCB Assembly: AI T...

    Alisher Orazgaliyev

    Discover how AI Technology, Inc.'s innovative SAC-based Transient Liquid Phase Sintering (TLPS) solder paste is transforming double-sided PCB assembly by eliminating the need for SMT adhesives. This advancement enhances efficiency...

  • The Great Debate: Ball Bonding vs. Wedge Bondin...

    Alisher Orazgaliyev

    In semiconductor packaging, choosing the right wire bonding technique is crucial for device performance and reliability.This article delves into the two primary methods—ball bonding and wedge bonding—highlighting their differences, advantages,...

    The Great Debate: Ball Bonding vs. Wedge Bondin...

    Alisher Orazgaliyev

    In semiconductor packaging, choosing the right wire bonding technique is crucial for device performance and reliability.This article delves into the two primary methods—ball bonding and wedge bonding—highlighting their differences, advantages,...

  • Next-Generation Sintering Technology – AIT’s OR...

    Alisher Orazgaliyev

    AIT’s ORMET® sintering technology is a lead-free, high-performance interconnect solution for semiconductor packaging and power electronics. At American Fairfield Inc., we provide ORMET® conductive pastes for thermal and electrical reliability...

    Next-Generation Sintering Technology – AIT’s OR...

    Alisher Orazgaliyev

    AIT’s ORMET® sintering technology is a lead-free, high-performance interconnect solution for semiconductor packaging and power electronics. At American Fairfield Inc., we provide ORMET® conductive pastes for thermal and electrical reliability...

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